6) Tech Process Experience: 7nm
7) Package Capability: 2D/ 2.5D CoWoS/ 3D SOC
EPIC SEMI:
1) DCA, VCA Lite
2) The Netlist(RTL)-to-GDSII Services offer DFT/BIST ATPG, Placement & Route (P&R), Physical Design, Timing Closure, IR-Drop Analysis (whole chip), EM, Low Power Implementation, Formal Verification, PV.
3) Turn-Key Service, TO.
4) IP customization and Hardening Services.
5) Tech Process Experience: 7nm, 5nm
6) Package Capability: 2.5D CoWoS
Struent Semiconductors:
("矽成金" 半導體有限公司):
1) The Netlist(RTL)-to-GDSII Services offer DFT/BIST ATPG, Placement & Route (P&R), Physical Design, Timing Closure, IR-Drop Analysis (whole chip), EM, Low Power Implementation, Formal Verification, PV.
2) Turn-Key Service, TO.
3) Tech Process Experience: 7nm